The Best Paper Award Committee of ESREF 2009
presents the Best Paper Awards to :
Multiscale Simulation of Aluminum Thin Films for the Design of Highly-Reliable MEMS Devices
by Haruka Kubo, Mauro Ciappa, Takayuki Masunaga and Wolfgang Fichtner
Reliability analysis of InGaN Blu-Ray Laser Diode
by N. Trivellin, M. Meneghini, G. Meneghesso, E. Zanoni, K. Orita, M. Yuri, T. Tanaka, D. Ueda
Investigation of Stress Distribution in Via Bottom of Cu-Via Structures with different Via form by means of Submodeling
by J. Ciptokusumo, K. Weide-Zaage, Oliver Aubel