TECHNICAL SCOPE

The conference will concentrate on two main areas of interest in electronics concerning designers, manufacturers and users:

The Technical Programme Committee selected original papers that address one or more of the following topics :

Quality and Reliability assessment techniques and methods for Devices and Systems

Physical Modeling and Simulation for Reliability Prediction

Advanced Failure Analysis: Defect Detection and Analysis

Failure Mechanisms in New Materials and Transistors

Failure analysis and Reliability of Advanced and Nanoscale electronics

Power Devices Reliability

Packaging and Assembly Reliability

For further information concerning the scientific programme, please contact:

Nathalie LABAT

esref2009@ims-bordeaux.fr