TECHNICAL SCOPE

The conference will concentrate on two main areas of interest in electronics concerning designers, manufacturers and users:

• Strategy for Quality and Reliability Assessment during Product Development and Life Cycle
• Advanced Analysis Techniques for Technologies and Product Evaluation

The Technical Programme Committee selected original papers that address one or more of the following topics :

Quality and Reliability assessment techniques and methods for Devices and Systems

• Design for reliability, Built-in reliability,
• Virtual qualification, Reliability simulation,
• Extreme environments,
• Advanced models for Reliability prediction,
• Reliability test structures, Limits to accelerated tests,
• Screening methods, Yield/reliability relationship.

Physical Modeling and Simulation for Reliability Prediction

• Characterization of defects, Defect models,
• Numerical simulation,
• Simulation of reliability in integrated circuits.

Advanced Failure Analysis: Defect Detection and Analysis

• Electron, ion and optical beam techniques,
• Scanning probe techniques,
• Static or dynamic techniques, Backside techniques,
• Acoustic microscopy,
• Electric or magnetic field based techniques
• Electrical, thermal and thermo-mechanical characterization,
• Sample preparation, construction analysis,
• Failure analysis: case studies.

Failure Mechanisms in New Materials and Transistors

• Process-related issues, Passivation stability,
• Hot carriers injection, NBTI, TDDB
• High-K dielectrics and gate stacks,
• Low-K dielectrics and Cu interconnects,
• ESD-EOS
• Metal migration: mechanical and thermal aspects,
• Radiation impact on circuits and systems reliability.

Failure analysis and Reliability of Advanced and Nanoscale electronics

• Non-volatile and programmable cells,
• Silicon on Insulator devices.
• Wide bandgap semiconductors,
• Microwave and compound semiconductor devices,
• Photonic devices: Optoelectronics, lasers and solar cells,
• Optical and NTC Interconnects,
• MEMS and MOEMS,
• NEMS and nano-objects.

Power Devices Reliability

• Smart-power devices, IGBT, thyristors,
• High voltage devices,
• Thermal management.

Packaging and Assembly Reliability

• Failure mechanisms and environmental constraints,
• MCM, CSP, BGA, SiP, WLP, QFN, advanced PCB,
• Bonding, solders and joints, Connectors,
• Passive elements.

For further information concerning the scientific programme, please contact:

Nathalie LABAT

esref2009@ims-bordeaux.fr